Plasma Etch Process Engineer

Role Overview

Join Applied Angstrom Technology (AAT) as a Process Engineer working at the forefront of semiconductor technology. This position involves applying atomic-level precision, material science, and surface engineering to advance technical innovations in semiconductor manufacturing.

Responsibilities

• Conduct research, development, and assessment of process engineering to support AAT's advanced semiconductor equipment and systems.
• Analyze and improve fabrication processes and techniques applied to semiconductor product manufacturing.
• Innovate and maintain new process developments aimed at reducing costs and boosting production yields.
• Collect and interpret test data to guide subsequent development phases and define process parameters within specifications.
• Collaborate internally on data collection, analysis, and customer demonstrations associated with current process applications.
• Engage cross-functionally and with customers to comprehend product roadmaps, process flows, critical milestones, and business needs.
• Contribute to the development and launch of next-generation semiconductor products in alignment with industry roadmaps.
• Lead process technicians by providing clear directions and guidance to support process execution.

Requirements

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Chemistry, Physics, or an allied engineering field.
• A minimum of three years of practical experience in semiconductor equipment development or semiconductor fabrication process engineering, preferably within R&D or pilot production environments.
• Competency in laboratory work and equipment operation, specifically wafer surface preparation, thin-film technologies, and analytical characterization techniques.
• Proficiency in Statistical Process Control (SPC), Design of Experiments (DOE), and systematic process optimization strategies.
• Experience in developing or refining semiconductor fabrication processes including dielectric or metal etching, thin-film deposition, surface treatment, or nanoscale patterning.