Package Equipment Engineering Manager / Lead – Semiconductor Manufacturing

Overview

Best NanoTech seeks a seasoned Package Equipment Engineering Manager or Lead to oversee equipment engineering for high-volume semiconductor assembly and packaging processes at their Ahmedabad facility. This full-time onsite role demands leadership over equipment installation, qualification, and maintenance strategies to optimize performance and availability within semiconductor packaging processes.

Role and Responsibilities

• Lead the equipment engineering team supporting round-the-clock semiconductor manufacturing operations.
• Responsible for equipment performance across die preparation, die attach, wire bonding, molding, marking, and package singulation stages.
• Manage all phases of equipment installation, setup, acceptance testing, qualification, and clearance for production.
• Develop clear equipment specifications, user requirements, and technical acceptance criteria.
• Coordinate activities including equipment hook-up, safety inspections, calibration, and process qualification.
• Implement preventive, predictive, and condition-based maintenance strategies to maximize uptime.
• Enhance equipment metrics such as availability, utilization, OEE, MTBF, and MTTR.
• Lead technical troubleshooting for persistent equipment failures, process deviations, and production disruptions.
• Analyze equipment data, alarms, logs, and failure records to spot opportunities for performance improvement.
• Create maintenance procedures, spare-parts plans, equipment checklists, and escalation protocols.
• Manage relationships with vendors regarding installation, warranty service, upgrades, and corrective measures.
• Collaborate with process engineers to improve equipment capability, consistency, and process control.
• Support new product introductions, capacity expansions, and ramp-ups in production.
• Drive initiatives for automation, sensor integration, data collection, and predictive maintenance.
• Oversee equipment modifications, retrofits, cost-saving, and productivity enhancement projects.
• Ensure compliance with environmental health and safety, equipment safety, cleanroom protocols, and quality standards.
• Develop technical talent through hiring, training, mentoring, and skills enhancement.
• Prepare performance dashboards and communicate equipment risks, recovery plans, and capital needs.

Qualifications and Experience

• Bachelor’s or Master's degree in Mechanical, Electrical, Electronics, Mechatronics, Instrumentation, Automation Engineering, or a related field.
• 12 to 18 years of experience in equipment engineering within semiconductor assembly, packaging, ATMP, OSAT, or IDM backend manufacturing environments.
• Minimum of 4 to 6 years in leadership roles managing equipment engineers, technicians, or significant equipment projects.
• Proven expertise with multiple semiconductor packaging equipment platforms and high-volume manufacturing support.
• Strong ability in equipment installation, qualification, and ongoing support in semiconductor manufacturing.
• Track record of improving OEE, equipment availability, MTBF, MTTR, and manufacturing throughput.
• Experience handling vendor management, service contracts, spare parts inventory, and technical escalations.
• Competence in supporting production and equipment issues in a 24/7 manufacturing setting.

Technical Expertise

• Semiconductor Packaging Equipment: wafer mounters, back grinders, wafer saw and dicing systems, die sorters, pick-and-place systems, die bonders, die attach equipment, wire bonders, flip-chip bonders, underfill and dispensing machines, transfer or compression molding equipment, trim-and-form systems, laser marking, package saw and singulation equipment, inspection and material handling machines.
• Equipment Engineering: installation, commissioning, site/factory acceptance testing, capability analysis, preventive and predictive maintenance, condition monitoring, calibration, equipment modifications and retrofits, troubleshooting, fault isolation, spare parts and lifecycle management.
• Automation and Controls: PLC and industrial controls, servo and motion systems, sensors, pneumatics, robotics, machine vision, equipment software, alarm systems, SECS/GEM protocols, data collection, MES integration, automated material handling, predictive maintenance analytics.
• Reliability and Improvement Tools: OEE, MTBF, MTTR, FMEA, root-cause analysis, 8D problem-solving, fault tree, Pareto analysis, TPM, Statistical Process Control.

Leadership and Management

• Build and lead a strong equipment engineering team dedicated to semiconductor packaging.
• Define clear equipment ownership for processes and production lines.
• Establish escalation paths and technical response requirements.
• Provide structured mentoring and training for engineers and technicians.
• Manage staffing, shift schedules, and on-call support for uninterrupted operations.
• Coordinate equipment resources during installation, capacity increases, and incident response.
• Implement vendor performance reviews and maintenance monitoring.

Performance Indicators

• Improve equipment availability and utilization.
• Optimize overall equipment effectiveness and mean time between failure.
• Reduce mean time to repair and unplanned downtime.
• Enhance preventive maintenance compliance and reduce equipment-related yield loss.
• Increase production throughput (units per hour) and maintain spare-parts availability.
• Control maintenance costs and ensure capacity for production readiness.